List of Topics

IEEE COMCAS is a multidisciplinary conference that brings together a fascinating technical program led by international invited experts and a professional exhibition by the leading companies in the industry.

Session topics span from the chip to the system, covering the disciplines of:

Communications and Sensors

  • Beyond 5G – Systems & Technologies
  • AI, Machine Learning, Deep Learning in Communications and Sensors
  • Big Data in Communication Networks
  • MIMO & Space-Time Coding Technologies
  • 5G systems & Millimeter Wave Propagation
  • Cognitive Radio & Spectral Sharing
  • Communications Security
  • First Responder/Military Communications
  • Green Communication
  • Internet of Things
  • Long Range Low Power Networks
  • Micro/Pico/Femtocell Devices and Systems
  • Modulation & Signal Processing Technologies
  • On-Body and Short Range Communications
  • Radio over Fiber & Optical/Wireless Convergence
  • Sensor Networks and Technologies
  • Software-Defined Radio & Multiple Access

Antennas, Propagation, and Scattering

  • Antenna Theory and Design
  • Smart Antennas, Beamforming and MIMO
  • Wave Propagation and Channel Modeling
  • Wave Scattering and RCS
  • NanoEM, Plasmonics, and Applications
  • Metamaterials, FSS and EBG
  • EM Field Theory and Numerical Techniques
  • EM Interference & Compatibility, SI
  • Spectrum Management and Monitoring
  • ELF, RF, μWave, mmW and THz Measurements

Signal Processing (SP) and Imaging

  • Microwave Imaging and Tomography
  • Acoustic/Sonar Imaging and Techniques
  • Radar SP and Imaging, SAR, ATR
  • MIMO SP for Radar
  • Ground and Foliage Penetration Systems
  • Signal Acquisition and Sensor Management
  • DF, Emitter Location, Elint, Array Processing
  • Target Detection, Identification and Tracking
  • Data Fusion
  • Time Domain and UWB SP
  • AI, Machine Learning, Deep Learning in Signal and Image Processing 

RF/MW Devices and Circuits, RFICs

  • Solid-State Devices, RFICs
  • μWave, mmW and Sub-mmW Circuits/Technologies
  • Nano and THz Devices/Technologies
  • Microwave Photonics
  • Passive Components and Circuits
  • Filters and Multiplexers
  • Ferroelectrics, RF MEMS, MOEMS, and NEMS
  • Active Devices and Circuits
  • RF Power Amplifiers and Devices
  • Tunable and Reconfigurable Circuits/Systems
  • Analog/Digital/Mixed RF Circuits
  • Circuit Theory, Modeling and Applications
  • Interconnects, Packaging and MCM
  • CAD Techniques for Devices and Circuits
  • Emerging Technologies
  • Internet of Things Devices

Microwave Systems, Radar, Acoustics

  • Aeronautical and Space Applications
  • RFID Devices/Systems/Applications
  • Automotive/Transportation Radar & Communications
  • Environmentally Sensitive (“Green”) Design
  • UWB and Multispectral Technologies & Systems
  • Emerging System Architectures
  • Modelling Techniques for RF Systems
  • Radar Techniques, Systems and Applications
  • Sonar Systems and Applications
  • Wireless Power Transfer & Energy Harvesting
  • Terahertz Systems
  • AI, Machine Learning, Deep Learning in Microwave, Radar, and Acoustic Systems

Biomedical Engineering

  • Big Data in Medicine
  • Artificial Intelligence, Machine Learning, Deep Learning
  • Biomedical Systems and Applications
  • Advances in Medical Imaging Technology 
  • Medical RF, MW & MMW Applications and Devices
  • Medical Image Processing
  • Acousto-Optic Technologies
  • Novel Therapeutic Modalities
  • Effects of RF and MW on Biological Tissues

Electronic Packaging & Thermal Management (P&TM)

  • Chip, Package and PCB – Design, Advanced Materials and Technologies
  • Chip & Board Level Assembly
  • Advanced Packaging – 2.5D, 3D and Heterogenous Integration
  • 3D Printing & Additive Manufacturing of Electronics
  • Electro Photonics Packaging
  • Adhesives, Molding & Encapsulation – Materials & Technologies
  • Soldering & Brazing for Electronic Packaging
  • Bio Medical Packaging
  • Plating & Coating – Materials & Technologies
  • Destructive and Non-destructive Testing
  • Thermal Management in Electronic Systems – Methods, Modeling and Solutions
  • Connectors, Cables & Routing
  • Inspection – Technologies & Methods
  • Reliability in Electronic Systems