Keynote Speakers

Prof. Theodore (Ted) S. Rappaport


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Invited Speakers

Prof. Francesco Andriulli

Politecnico di Torino, Italy

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Dr. Oscar Borries

TICRA, Denmark

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Prof. Karu Essel

University of Technology, Sydney, Australia

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Prof. Roberto D. Graglia

Politecnico di Torino,

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Prof. Yejun He

Shenzhen University

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Prof. Polina Kuzhir

University of Eastern Finland

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Prof. Antonio Maffucci

University of Cassino and Southern Lazio, Cassino, Italy

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Prof. Vladimir I. Okhmatovski

University of Manitoba, Canada

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Dr. Felix Vega

Technology Innovation Institute, Abu Dhabi, UAE

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Prof. Andrea Massa

University of Trento, Italy

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Prof. Giacomo Oliveri

ELEDIA Research Center, ELEDIA@UniTN, University of Trento, Italy

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Prof. Paolo Rocca

University of Trento, Italy

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Prof. Mei Song Tong

Tongji University

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Prof. Ludger Klinkenbusch

Kiel University, Germany

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Prof. Shanker Balasubramaniam

Ohio State University, USA

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Prof. Fedor Kusmartsev

Khalifa University, Abu Dhabi, UAE

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Prof. Nikolaos Tsitsas

Aristotle University of Thessaloniki, Greece

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Prof. Gabriele Gradoni

University of Surrey, U.K.

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Prof. Olav Breinbjerg

Independent Consultant, Denmark

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Prof. Claudio Curcio

Università di Napoli Federico II, Italy

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Prof. Francesco D'Agostino

University of Salerno, Italy

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Dr. Lars J. Foged

Microwave Vision Group, Italy

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Prof. Eric Michielssen

University of Michigan, USA

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Prof. Ingmar Kallfass

University of Stuttgart, Germany

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Prof. Corrado Carta

IHP - Leibniz-Institut für innovative Mikroelektronik, Germany

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Prof. Viktor Krozer

Goethe University, Germany

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Prof. Giuliano Manara

University of Pisa, Italy

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Prof. Nemai Karmakar

Monash University, Clayton, Australia

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Prof. Mário G. Silveirinha

University of Lisbon, Portugal

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Prof. Oskars Ozolins

Riga Technical University, Latvia

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Prof Nadav Levanon

Tel Aviv University, Israel

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  • April 4, 2023 - Proposals deadline for workshops, short courses and tutorials
  • April 18, 2023 - Summary / Paper submission deadline
  • July 3, 2023 - Notification of acceptance
  • September 4, 2023 - Speaker's registration deadline
  • September 4, 2023 - Final manuscript submission

Welcome to IEEE COMCAS 2023

On behalf of the IEEE COMCAS 2023 Steering Committee, it is our pleasure to launch the 9th International IEEE Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023). In 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, and industry experience in a range of key areas i.e., microwaves, communications and sensors, antennas, biomedical engineering, RF and microwave devices and circuits, thermal management and electronic packaging, signal processing and imaging, as well as radar, acoustics and microwave system engineering. In its entirety the event includes a technical program, industry exhibits, and guest presentations from global experts on recent academic and industry advancements.


In launching the 2023 event, we would also like to welcome you to the sunshine of the eastern Mediterranean, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation Tel Aviv is a center that resonates with an energized atmosphere, streets of storied history, and an internationally recognized nightlife. Taking place 6-8 November 2023 in Tel Aviv, Israel, at the David Intercontinental Hotel by the Mediterranean Sea; IEEE COMCAS will continue a biennial series tailored to maximize professional networking, support the candid exchange of ideas, and develop a range of enduring opportunities.



Our Technical Program is paired with a Technical Exhibition that offers companies and agencies a unique opportunity to visit Israel, present relevant products and quality services, and pursue key networking opportunities. Attendees can take part and engage with new contacts, create business opportunities and solidify contracts for the future.


IEEE COMCAS is recognized as one of the world's leading IEEE conferences and a specialty in its field. The event receives hundreds of manuscript submissions, draws together speakers from public, private, and academic practice, and presents the next frontier of industry potential.


Held before the COVID-19 pandemic, IEEE COMCAS 2019 was our greatest success to date with nearly 1900 attendees, over 240 guest lectures, in 88 sessions, alongside participants from 39 countries, and exhibitors from more than 100 industry vendors. Despite COVID-19 and its impact on events and travel, IEEE COMCAS 2021 was successful in attracting approximately 1200 attendees. Following 3 years of world transformation, we are confident that IEEE COMCAS 2023 will transcend our expectations on both a professional and personal level.


We invite you to join us in Tel Aviv 6-8 November 2023, and enjoy returning as a part of our active community at IEEE COMCAS.



  • Shmuel Auster
    General Chair
    Chair, IEEE Israeli Society of Elctronics Engineers, AEAI
  • Amir Boag
    Technical Program Chair

Watch, Hear & Learn

Exchange ideas, get updates on the latest research results and industry experiences, meet and learn from leading experts and speakers, participate in attractive workshops and interactive seminars.

Visit Exhibition

Interact with 100 international exhibitors demonstrating the latest in technology. See and ask questions related to the latest products, components and materials and expand your business suppliers and partners' network.

Meet & Connect

You can get a year’s worth of networking done in your industry in three conference days.

This is your opportunity to not only meet and ask but offer and suggest. A chance to get together with the leaders from your industry that can take your business one step forward.

  • 1600+ Participants
  • 40 Countries
  • 230 Presentations
  • 90 Exhibitors