Advanced Radar Systems and Concepts
Monday, November 13, 14:20-15:40, Hall H
Chair: Caleb J. Fulton, University of Oklahoma, USA.
The session will survey a number of modern radar system developments and emerging techniques and technologies within the radar landscape.
Updates on Next-Generation Array-Based Weather Radar Developments at the University of Oklahoma
Caleb J. Fulton, University of Oklahoma, USA
Error Estimation in Retrodirective Channel Implementation
Björn Petersson, KTH Royal Institute of Technology & Saab Surveillance, Sweden
Distributed Radar Systems
Ronit Levy Nathansohn, IAI/Elta systems, Israel
Remote Sensing Change Detection for Disaster Management
Stanley Rotman, Ben-Gurion University of the Negev, Israel
The Future of Wireless Communication
Tuesday, November 14, 11:10-13:00, Hall C
Chair: Irving Kalet, Azrieli, College of Engineering, Israel and Columbia University, USA
The session will address the possible directions of wireless communications in the near future.
Low-Density Code-Domain NOMA: An Analytical View
Shlomo Shamai, Technion, Israel
OTFS: A New Generation of Modulation Addressing the Challenges of 5G
Ronny Hadani, Cohere Technologies
Millimeter Waves- Channel Characteristics, Limitations and Opportunities for 5G Technology
chasi, Ariel University, Israel
New Results in Massive MIMO
Ender Ayanoglu, University of California, Irvine, USA
Panel discussion opened to questions and comments from the audience
Wednesday, November 15, 09:00-10:50, Hall J
Chairs: Gennady Ziskind Ben-Gurion University of the Negev, Israel
Avram Bar-Cohen Raytheon – Space and Airborne Systems, USA
Near-junction thermal barriers severely limit the inherent capability of high-quality wide bandgap materials and architectures and necessitate the development of an alternative, Gen3, thermal management paradigm to reach the goals of future high-power RF applications. Recent Gen3 “embedded cooling” efforts in the aerospace industry, including DARPA’s NJTT and ICECool programs, have focused on reduction of this near-junction thermal resistance, through the use of diamond substrates, and efficient removal of the dissipated power with on-chip convective and jet impingement microfluidics. The options, challenges, and techniques associated with the development of embedded thermal management technology are described, with emphasis on the accomplishments and status of efforts related to GaN power amplifiers. Raytheon’s ICECool demonstration MMIC’s, which achieved 4.5x the RF power output and 7x the RF power density of a comparable baseline, will be used to illustrate the efficacy of this approach.
The session will include a presentation and discussion by Frank Traut (Macom) on the issue of GaN on Si vs SiC from a temperature perspective.