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Call for Papers

Submission of Full Manuscript is NOW available

For Manuscript Submission Instructions, please click HERE

Call For Papers (For the PDF file, please download HERE)

IEEE COMCAS 2019 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar, electronic systems engineering and Bio-Medical Engineering. It includes a technical program, industry exhibits, and invited talks by international experts in key topical areas.

The conference will take place on 4-6 November, 2019 in Tel Aviv, Israel. The David Intercontinental Hotel on the Mediterranean sea offers an excellent venue for networking and the candid exchange of ideas.

Important Dates:
Manuscript Submission Deadline - April 18, 2019
Notification of Acceptance - July 2, 2019
Final Paper submission Deadline - September 2, 2019

Deadline for authors registration - September 10, 2019*
* At least one author of each accepted paper

Papers are solicited in a wide range of topics:

 

 

Communications and Sensors

5G systems & millimeter wave propagation
Cognitive Radio & Spectral Sharing
Communications Security
First Responder/Military Communications 
Green Communication 
Internet of Things 
Long Range Low Power Networks 
Micro/Pico/Femtocell Devices and Systems 
MIMO Antenna Systems for Communications   
Modulation & Signal Processing Technologies
On-Body and Short Range Communications 
Radio over Fiber & Optical/Wireless Convergence 
Sensor Networks and Technologies
Software-Defined Radio & Multiple Access 
Space-Time Coding and Systems

 

 

Antennas, Propagation, and Scattering


Smart Antennas, Beamforming and MIMO
Wave Propagation and Channel Modeling
Wave Scattering and RCS
NanoEM, Plasmonics, and Applications
Metamaterials, FSS and EBG
EM Field Theory and Numerical Techniques
EM Interference & Compatibility, SI
Spectrum Management and Monitoring
RF, uWave, mmW and THz Measurements

 

Signal Processing (SP) and Imaging


Microwave Imaging and Tomography
Acoustic/Sonar Imaging and Techniques
Biomedical Image Processing
Radar SP and Imaging, SAR, ATR 
MIMO SP for Radar

Ground and Foliage Penetration Systems
Signal Acquisition and Sensor Management
DF, Emitter Location, Elint, Array Processing 
Target Detection, Identification and Tracking 
Data Fusion 
Time Domain and UWB SP

RF/MW Devices and Circuits, RFICs


Solid-State Devices, RFICs 
uWave, mmW and Sub-mmW Circuits/Technologies Nano and THz Devices/Technologies 
Microwave Photonics 
Passive Components and Circuits 
Filters and Multiplexers
Ferroelectrics, RF MEMS, MOEMS, and NEMS 
Active Devices and Circuits 
RF Power Amplifiers and Devices 
Tunable and Reconfigurable Circuits/Systems Analog/Digital/Mixed RF circuits 
Circuit Theory, Modeling and Applications Interconnects, Packaging and MCM 
CAD Techniques for Devices and Circuits 
Emerging Technologies
Thermal Management for Devices
Internet of Things

 

Microwave Systems, Radar, Acoustics 


Aeronautical and Space Applications 
RFID Devices/Systems/Applications
Automotive/Transportation Radar & Communications
Environmentally Sensitive ("Green") Design
Biomedical Systems and Applications
UWB and Multispectral Technologies & Systems
Emerging System Architectures
Modelling Techniques for RF Systems
Radar Techniques, Systems and Applications
Sonar Systems and Applications
Wireless Power Transfer & Energy Harvesting
Terahertz Systems

 

Biomedical Engineering 

Novel Imaging Technologies

Novel Therapeutic Modalities

Acousto-Optic Technologies

Advances in MRI, Systems and Applications

Medical RF, MW & MMW Applications and Devices

Medical Imaging and Image Processing

The Effects of RF and MW on Biological Tissues

 

Papers accepted for publication will be presented either as a 20-minute (including Q&A) oral session or as a poster in a poster session. All presentations require the presence of at least one of the authors who must be registered to attend the conference.  The conference proceedings will be submitted for inclusion in IEEE Xplore®.  
 

 

Sponsors

                                


 

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